Electrochemical nucleation of copper on ruthenium -: Effect of Cl-, PEG, and SPS

被引：26

作者：

Zheng, M ^{[1
]}

Willey, M ^{[1
]}

West, AC ^{[1
]}

机构：

[1] Columbia Univ, Dept Chem Engn, New York, NY 10027 USA

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2005年 / 8卷 / 10期

关键词：

D O I：

10.1149/1.2035701

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The effect of bath composition on the initial stages of copper electrodeposition onto Ru substrates is reported. The impact of additives and bulk cupric-ion concentration is reported for both potentiostatic and galvanostatic operation. The presence of chloride ions and polyethylene glycol leads to an increase in the density of Cu particles, while bis (3-sulfopropyl) disulfide leads to a decrease in particle density for potentiostatic comparisons and a slight increase or perhaps remains constant when results at the same current density are compared. (c) 2005 The Electrochemical Society.

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页码：C151 / C154

页数：4

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