Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline

被引：5
作者：
Choi, Eun Byeol [1 ]
Lee, Jong-Hyun [2 ]
机构：
[1] Seoul Natl Univ Sci & Technol, Program Mat Sci & Engn, Convergence Inst Biomed Engn & Biomat, Seoul 01811, South Korea
[2] Seoul Natl Univ Sci & Technol, Dept Mat Sci & Engn, Seoul 01811, South Korea
来源：
METALS AND MATERIALS INTERNATIONAL | 2021年 / 27卷 / 12期
关键词：
Cu dendritic particle; Sinter-bonding; Bending deformation; Nanonodule; Shear strength; DIE ATTACHMENT; NANOPARTICLES; JOINTS; PASTE;
D O I：
10.1007/s12540-020-00806-6
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A pressure-assisted sinter-bonding technique in air using modified Cu dendritic particles is suggested to obtain a high-temperature sustainable bondline for wide band-gap power devices. The combination of void filling by the bending deformation of stems in the dendritic particles, prompt sintering of nanonodules on the surfaces of the particles, and generation of fresh Cu by in situ reduction on surfaces of the particles exhibited extremely rapid sinter bonding. A die attached under 10 MPa for 10 s at 300 degrees C and under 5 MPa for 60 s at 350 degrees C demonstrated shear strength of 26.2 and 20.6 MPa, respectively, surpassing that of a die attached using Pb-5Sn.
引用
收藏
页码：5278 / 5284
页数：7
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