Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration' " [Appl. Phys. Lett. 79, 1061 (2001)]

被引：9
|
作者：
Tu, KN [1 ]
机构：
[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA
来源：
APPLIED PHYSICS LETTERS | 2001年 / 79卷 / 07期
关键词：
D O I：
10.1063/1.1386625
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：1063 / 1063
页数：1
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