Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration' " [Appl. Phys. Lett. 79, 1061 (2001)]

被引：9

作者：

Tu, KN ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

APPLIED PHYSICS LETTERS | 2001年 / 79卷 / 07期

关键词：

D O I：

10.1063/1.1386625

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1063 / 1063

页数：1

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