A 70 GHz Chip to Printed Circuit Board Interconnect using Kapton Flexible Substrate

被引：0

作者：

Mehta, Shyam G. ^{[1
]}

Milner, Leigh E. ^{[1
]}

Parker, Michael E. ^{[1
]}

机构：

[1] Def Sci & Technol Grp, Adelaide, SA, Australia

来源：

2016 IEEE 2ND AUSTRALIAN MICROWAVE SYMPOSIUM (AMS) | 2016年

关键词：

Flexible substrates; Kapton; Coplanar waveguide (CPW); broadband; flip chip; wire bond;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A method of connecting integrated circuits to Printed Circuit Board (PCB) carriers with broadband frequency response is presented using Kapton film as a flexible, interconnecting substrate. Flip chip processing is applied using a simple and effective technique to curve the flexible substrate, accommodating different heights between the chip and PCB. Measurements of a test assembly show a return loss more than 15 dB and insertion loss less than 1.0 dB from DC to 70 GHz.

引用

页码：9 / 10

页数：2