PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays

被引：14

作者：

Andreev, Artem Aleksandrovich ^{[1
]}

Sridhar, Arvind ^{[2
]}

Sabry, Mohamed M. ^{[3
]}

Zapater, Marina ^{[1
]}

Ruch, Patrick ^{[2
]}

Michel, Bruno ^{[2
]}

Atienza, David ^{[1
]}

机构：

[1] Swiss Fed Inst Technol Lausanne EPFL, ESL, CH-1015 Lausanne, Switzerland

[2] IBM Res Zurich, CH-8803 Ruschlikon, Switzerland

[3] Stanford Univ, Robust Syst Grp, Stanford, CA 94305 USA

来源：

IEEE TRANSACTIONS ON COMPUTERS | 2018年 / 67卷 / 01期

基金：

瑞士国家科学基金会;

关键词：

3D MPSoCs; thermal modeling; liquid cooling; electrochemical flow cell; BATTERY; DESIGN; ENERGY;

D O I：

10.1109/TC.2017.2695179

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Integrated Flow-Cell Arrays (FCAs) represent a combination of integrated liquid cooling and on-chip power generation, converting chemical energy of the flowing electrolyte solutions to electrical energy. The FCA technology provides a promising way to address both heat removal and power delivery issues in 3D Multiprocessor Systems-on-Chips (MPSoCs). In this paper we motivate the benefits of FCA in 3D MPSoCs via a qualitative analysis and explore the capabilities of the proposed technology using our extended PowerCool simulator. PowerCool is a tool that performs combined compact thermal and electrochemical simulation of 3D MPSoCs with inter-tier FCA-based cooling and power generation. We validate our electrochemical model against experimental data obtained using a micro-scale FCA, and extend PowerCool with a compact thermal model (3D-ICE) and subthreshold leakage estimation. We show the sensitivity of the FCA cooling and power generation on the design-time (FCA geometry) and run-time (fluid inlet temperature, flow rate) parameters. Our results show that we can optimize the FCA to keep maximum chip temperature below 95 degrees C for an average chip power consumption of 50 W/cm(2) while generating up to 3.6 W per cm(2) of chip area.

引用

页码：73 / 85

页数：13

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