Realization of holographic optical interconnects for a multichip module on silicon

被引:0
|
作者
Grubert, HU [1 ]
机构
[1] SICAN GmbH, D-30419 Hannover, Germany
来源
OPTOELECTRONIC INTERCONNECTS V | 1998年 / 3288卷
关键词
holographic optical interconnects; multichip modules;
D O I
10.1117/12.307583
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The design, assembly and packaging of a multichip module on silicon with a holographic-optical 1 to 4 interconnect is presented. The potential of the system containing commercially available components is demonstrated. Holographic optical elements in dichromated gelatine as well as computer-generated holograms are used to distribute and focus a clock signal generated by a vertical-cavity surface-emitting laser diode onto silicon photodiodes. The two different kinds of holograms are compared with respect to their efficiency, fabrication effort and compatibility with the demands of a microelectronic system. Alignment issues, thermal behavior and the total optical link efficiency are discussed.
引用
收藏
页码:279 / 286
页数:8
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