共 11 条
[1]
Amey DI, 1997, 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, P158, DOI 10.1109/ISAPM.1997.581283
[2]
AMEY DI, 1991, EL COMP TECHN C, V11, P267
[3]
CHEN AC, 2005, EL COMP TECHN C
[4]
CHEN M, 2005, P IPACK2005 ASME INT
[5]
A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials
[J].
9TH INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2004 PROCEEDINGS,
2004,
:241-246
[6]
KINAYMAN N, 2005, ARTECH MICR, pR11
[7]
MENZEL W, 2003, IEEE T MICROW THEORY, V51, P2
[8]
STERN F, 2005, CIRCUI TREE JUN 10 1
[9]
RF/microwave characterization of multilayer ceramic-based MCM technology
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
1999, 22 (03)
:326-331