Basic Diode SPICE Model Extension and a Software Characterization Tool for Reverse Recovery Simulation

被引：0

作者：

Zaikin, Denys I. ^{[1
]}

机构：

[1] EKTOS AS, Viborg, Denmark

来源：

2015 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL TECHNOLOGY (ICIT) | 2015年

关键词：

SPICE; diodes; reverse recovery; circuit simulation; software characterization tools; semiconductor device modeling;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The paper describes the way of extending a basic diode SPICE model for a possibility to simulate realistic reverse recovery of power diodes. The proposed macro model uses all basic diode model characteristics and processes the diffusion capacitance current for adjusting reverse recovery. A Windows application tool was made to simplify creating a new diode SPICE sub-model using the manufacturer data sheet or measured data. Experimental data are presented for comparison of the proposed model and real diode reverse recovery.

引用

页码：941 / 945

页数：5

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