A universal adhesive containing copper nanoparticles improves the stability of hybrid layer in a cariogenic oral environment: An in situ study

被引：14

作者：

Vidal, Omar ^{[1
]}

Matos, Thalita de Paris ^{[2
]}

Nunez, Alejandra ^{[1
,3
]}

Mendez-Bauer, Lujan ^{[1
,4
]}

Sutil, Elisama ^{[1
]}

Naupari-Villasante, Romina ^{[1
]}

Souta, Melissa Caroline ^{[1
]}

Pitlovanciv, Murilo ^{[1
]}

Gutierrez, Mario F. ^{[5
,6
]}

Loguercio, Alessandro D. ^{[1
]}

机构：

[1] Univ Estadual Ponta Grossa, Sch Dent, Dept Restorat Dent, Rua Carlos Cavalcanti 4748, BR-84030900 Ponta Grossa, Parana, Brazil

[2] Univ Tuiuti Parana, Dept Dent, Rua Sydnei Antonio Rangel Santos 238, BR-82010330 Curitiba, Parana, Brazil

[3] Univ San Francisco Quito USFQ, Dept Odontol Restauradora & Mat Dentales, Escuela Odontol, Av Pampite & Diego de Robles, Quito 170901, Ecuador

[4] Univ Francisco Marroquin, Dept Res, Fac Dent, 6th St 7-11 Zone 10, Guatemala City 01010, Guatemala

[5] Univ Los Andes, Fac Odontol, Av Monsenor Alvaro Portillo 12455, Santiago 7550000, Chile

[6] Univ Chile, Fac Dent, Inst Res Dent Sci, Physiol Lab, Av Olivos 943, Santiago 8380544, Chile

来源：

JOURNAL OF THE MECHANICAL BEHAVIOR OF BIOMEDICAL MATERIALS | 2022年 / 126卷

关键词：

Universal adhesive system; Copper; Nanoparticles; Microtensile bond strength; Nanoleakage; In situ; MATRIX METALLOPROTEINASES; COMPOSITE RESTORATIONS; MULTIMODE ADHESIVE; RESIN COMPOSITE; RINSE ADHESIVE; DEGRADATION; DURABILITY; LONGEVITY; BEHAVIOR; ENAMEL;

D O I：

10.1016/j.jmbbm.2021.105017

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

Purpose: To evaluate how incorporating copper nanoparticles (CuNp) into a universal adhesive affects the antimicrobial activity (AMA), bond strength (mu TBS), nanoleakage (NL), elastic modulus (EM) and nanohardness (NH) of resin-dentin interfaces, at 24 h (24 h) and after in situ cariogenic challenge (CC). Methods: CuNp (0% [control] and 0.1 wt%) was added to an adhesive. After enamel removal, the adhesives were applied to dentine surfaces. Each restored tooth was sectioned longitudinally to obtain two hemi-teeth; one of them was evaluated after 24 h, and the other was included in one of the intra-oral palatal devices placed in the mouths of 10 volunteers for 14 days in CC. After that, each hemi-tooth was removed, and any oral biofilm that formed was collected. The AMA was evaluated against Streptococcus mutans. For the 24 h and CC groups, each hemi-tooth was sectioned in the "x" direction to obtain one slice for each EM/NH evaluation. The remains of each hemi-tooth were sectioned in the "x" and "y" directions to obtain resin-dentin beams for mu TBS and NL evaluation (24 h and CC). ANOVA and Tukey's test were applied (alpha = 0.05). Results: The presence of CuNp significantly improved AMA as well as all of the evaluated properties (24 h; p < 0.05). Although the adhesive properties (mu TBS/NL) for all groups decreased after CC (p < 0.05), the adhesive containing CuNp showed higher mu TBS and lower NL as compared to the copper-free adhesive (p < 0.05). The incorporation of CuNp maintained NH/EM values after CC (p < 0.05). Conclusions: Adding 0.1% CuNp to an adhesive may provide antimicrobial activity and increase its bonding and mechanical properties, even under a cariogenic challenge. Significance: This is the first in situ study proving that incorporating CuNp into an adhesive is an achievable alternative to provide antimicrobial properties and improve the integrity of the hybrid layer under in situ cariogenic challenge.

引用

页数：9

共 41 条

[41] Biofilm composition and composite degradation during intra-oral wear [J].

Yulianto, H. Dedy Kusuma ;

Rinastiti, Margareta ;

Cune, Marco S. ;

de Haan-Visser, Willy ;

Atema-Smit, Jelly ;

Busscher, Henlz J. ;

van der Mei, Henny C. .

DENTAL MATERIALS, 2019, 35 (05) :740-750

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