Proton-based total-dose irradiation effects on Cu/HfO2:Cu/Pt ReRAM devices

被引:50
作者
Butcher, Brian [1 ]
He, Xiaoli [1 ]
Huang, Mengbing [1 ]
Wang, Yan [2 ]
Liu, Qi [2 ]
Lv, Hangbing [2 ]
Liu, Ming [2 ]
Wang, Wei [1 ]
机构
[1] SUNY Albany, CNSE, Albany, NY 12203 USA
[2] Chinese Acad Sci, Lab Nanofabricat & Novel Devices Integrated Techn, Inst Microelect, Beijing 100029, Peoples R China
基金
美国国家科学基金会;
关键词
RESISTIVE SWITCHING MEMORIES; FERROELECTRIC PZT CAPACITORS; GATE DIELECTRICS; RADIATION; RELIABILITY; MECHANISMS; HFO2;
D O I
10.1088/0957-4484/21/47/475206
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The resistive switching properties of Cu-doped-HfO2-based resistive-random-access-memory (ReRAM) devices are investigated under proton-based irradiations with different high-range total doses of 1.5, 3 and 5 Giga-rad[Si]. The measurement results obtained immediately after irradiation demonstrate that the proton-based total dose will introduce significant variations in the operation voltages and resistance values. These effects are enhanced almost linearly when the dose increases from 1.5 to 5 Giga-rad[Si]. Furthermore, five days after irradiation, the electrical properties of the device rebound, resulting in reduced operation voltages and resistance values. This is consistent with the time-dependent super-recovery behavior observed previously in CMOS gate oxide. These results can be explained by the proton irradiation effect on the electron/hole trap density inside HfO2 and its impact on ReRAM device metallic filament formation-and-rupture, which is based on electrolyte theory.
引用
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页数:5
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