Low Temperature Sintering and Dielectric Properties of Alumina-Filled Glass Composites for LTCC Applications

被引：59

作者：

Rajesh, Surendran ^{[1
,2
]}

Jantunen, Heli ^{[1
,2
]}

Letz, Martin ^{[3
]}

Pichler-Willhelm, Sabine ^{[4
]}

机构：

[1] Univ Oulu, Microelect Lab, FI-90014 Oulu, Finland

[2] Univ Oulu, Mat Phys Lab, FI-90014 Oulu, Finland

[3] Schott AG, Res & Technol Dev, D-55122 Mainz, Germany

[4] Schott Elect Packaging GmbH, R&D Prod Div Glass, D-84032 Landshut, Germany

来源：

INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY | 2012年 / 9卷 / 01期

基金：

芬兰科学院;

关键词：

GLASS/CERAMIC COMPOSITES; PARTICLE-SIZE; CERAMICS; DENSIFICATION; MICROSTRUCTURE; BEHAVIORS;

D O I：

10.1111/j.1744-7402.2011.02684.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Glass + ceramic composites using lead-free ultralow-softening point glass matrices (brand names G018-249 and G018-250) with alumina fillers are investigated. The composites show good densification with near zero shrinkage at very low sintering temperature and do not show either the formation of secondary crystalline phases or dissolution of alumina. They further show no reactivity with the silver electrodes at a sintering temperature of 650 degrees C and have permittivities of 9.5 and 8.8, loss tangents of 0.0068 and 0.0087 at 1 MHz for the samples containing G018-249 glass and G018-250 glass, respectively.

引用

页码：52 / 59

页数：8

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