Effect of width scaling on RF and DC performance of AlGaN/GaN-based Ku-band multi-finger 250 nm high electron mobility transistor technology

被引:4
作者
Jha, Jaya [1 ]
Surapaneni, Sreenadh [1 ]
Kumar, Akhil S. [1 ]
Ganguly, Swaroop [1 ]
Saha, Dipankar [1 ]
机构
[1] Indian Inst Technol, Appl Quantum Mech Lab, Mumbai 400076, Maharashtra, India
关键词
GaN; HEMTs; Multi-finger; Power density; RF performance; Width; HIGH-POWER; HEMTS; POLARIZATION; OPERATION; TRADEOFF;
D O I
10.1016/j.sse.2021.108138
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Radio-frequency (RF) high-power high electron mobility transistors (HEMTs) are fabricated with multiple fingers and larger widths to increase the output delivered power. The increased power handling capability is a consequence of the increased capability of handling a larger drain-to-source current. The current is distributed over multiple fingers to keep the current and power density low to avoid heating effects. The width of the devices is also kept preferably long to avoid an excessively large number of fingers and fabrication challenges. However, despite the necessity of maintaining the linear scaling of output power with an effective total width, nonlinearity and non-scalability are intrinsically present. This non-ideality happens due to the aperiodic nature of the multiple-finger device structures and their response to RF signals. This work investigates the effect of varying widths and the variable number of fingers on the DC and RF performance of AlGaN/GaN HEMTs. HEMTs with appropriate sizes are fabricated and characterized. The DC characteristics mostly scale linearly with width (W) and the number of fingers (n). Contrary to the DC performance, the RF characteristics do not linearly scale with W and n but degrade after some threshold value for W for a given n and input power.
引用
收藏
页数:7
相关论文
共 28 条
  • [1] Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures
    Ambacher, O
    Foutz, B
    Smart, J
    Shealy, JR
    Weimann, NG
    Chu, K
    Murphy, M
    Sierakowski, AJ
    Schaff, WJ
    Eastman, LF
    Dimitrov, R
    Mitchell, A
    Stutzmann, M
    [J]. JOURNAL OF APPLIED PHYSICS, 2000, 87 (01) : 334 - 344
  • [2] [Anonymous], 2019, PLANAR ELECTROMAGNET
  • [3] Hot-Electron Degradation of AlGaN/GaN High-Electron Mobility Transistors During RF Operation: Correlation With GaNBuffer Design
    Bisi, Davide
    Chini, Alessandro
    Soci, Fabio
    Stocco, Antonio
    Meneghini, Matteo
    Pantellini, Alessio
    Nanni, Antonio
    Lanzieri, Claudio
    Gamarra, Piero
    Lacam, Cedric
    Tordjman, Maurice
    di-Forte-Poisson, Marie-Antoinette
    Meneghesso, Gaudenzio
    Zanoni, Enrico
    [J]. IEEE ELECTRON DEVICE LETTERS, 2015, 36 (10) : 1011 - 1014
  • [4] Fabrication of AlGaN/GaN Fin-Type HEMT Using a Novel T-Gate Process for Improved Radio-Frequency Performance
    Cho, Min Su
    Seo, Jae Hwa
    Lee, Sang Ho
    Jang, Hwan Soo
    Kang, In Man
    [J]. IEEE ACCESS, 2020, 8 : 139156 - 139160
  • [5] V-gate GaNHEMTs for X-band power applications
    Chu, Rongming
    Shen, Likun
    Fichtenbaum, Nicholas
    Brown, David
    Chen, Zhen
    Keller, Stacia
    DenBaars, Steven P.
    Mishra, Umesh K.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2008, 29 (09) : 974 - 976
  • [6] Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation
    Chvala, Ales
    Marek, Juraj
    Pribytny, Patrik
    Satka, Alexander
    Stoffels, Steve
    Posthuma, Niels
    Decoutere, Stefaan
    Donoval, Daniel
    [J]. MICROELECTRONICS RELIABILITY, 2017, 78 : 148 - 155
  • [7] Ku- and K-band high-efficiency GaN MMIC HPA chipset for satellite communications
    Fong, A.
    Srisathapat, J.
    Chin, C.
    Telvin, F.
    Grebliunas, J.
    Wu, G.
    [J]. ELECTRONICS LETTERS, 2019, 55 (07) : 393 - 394
  • [8] Aspect Ratio Impact on RF and DC Performance of State-of-the-Art Short-Channel GaN and InGaAs HEMTs
    Guerra, Diego
    Akis, Richard
    Marino, Fabio A.
    Ferry, David K.
    Goodnick, Stephen M.
    Saraniti, Marco
    [J]. IEEE ELECTRON DEVICE LETTERS, 2010, 31 (11) : 1217 - 1219
  • [9] High RF Performance Enhancement-Mode Al2O3/AlGaN/GaN MIS-HEMTs Fabricated With High-Temperature Gate-Recess Technique
    Huang, Sen
    Liu, Xinyu
    Zhang, Jinhan
    Wei, Ke
    Liu, Guoguo
    Wang, Xinhua
    Zheng, Yingkui
    Liu, Honggang
    Jin, Zhi
    Zhao, Chao
    Liu, Cheng
    Liu, Shenghou
    Yang, Shu
    Zhang, Jincheng
    Hao, Yue
    Chen, Kevin J.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2015, 36 (08) : 754 - 756
  • [10] Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors
    Ibbetson, JP
    Fini, PT
    Ness, KD
    DenBaars, SP
    Speck, JS
    Mishra, UK
    [J]. APPLIED PHYSICS LETTERS, 2000, 77 (02) : 250 - 252