Characteristics of dynamic recrystallization in semi-solid CuSn10P1 alloy during hot deformation

被引：31
作者：
Wang, Qiuping [1 ,2 ]
Zhou, Rongfeng [1 ,2 ,3 ]
Li, Yongkun [1 ,2 ,3 ]
Geng, Baoyu [1 ,2 ]
机构：
[1] Kunming Univ Sci & Technol, Fac Mat Sci & Engn, Kunming 650093, Yunnan, Peoples R China
[2] Kunming Univ Sci & Technol, Res Ctr Anal & Measurement, Kunming 650093, Yunnan, Peoples R China
[3] Analyt & Testing Res Ctr Yunnan, Kunming 650093, Yunnan, Peoples R China
来源：
MATERIALS CHARACTERIZATION | 2020年 / 159卷
基金：
中国国家自然科学基金;
关键词：
Cu-Sn alloy; Dynamic recrystallization; Dislocation; Deformation mechanism; MECHANICAL-PROPERTIES; EVOLUTION; MICROSTRUCTURE; BEHAVIOR; EBSD; BRONZE;
D O I：
10.1016/j.matchar.2019.109996
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The hot deformation behavior of semi -solid CuSn10P1 alloy prepared by isothermal compression experiment was investigated under the temperature condition of 450 degrees C, a strain rate of 0.01-1 s(-1) and strain range of 0.11-0.92. Scanning electron microscope, electron backscattered diffraction technique and transmission electron microscopy are employed to study the hot deformed microstructural evolution. The results show that with the increase of dynamic recrystallization, the low angle grain boundaries gradually transform to twinning boundaries of Sigma 3. The microstructural changes indicate that continuous and discontinuous dynamic recrystallization occur in CuSn10P1 alloy during hot deformation. However, in the low angle grain boundaries of 0 - 10 degrees dislocation orientation, discontinuous dynamic recrystallization has little nucleation effect on dynamic recrystallization. Continuous dynamic recrystallization dominated by subgrain merging and rotation is the main nucleation mechanism in semi-solid CuSn1OP1 alloy.
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页数：11
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