Microstructure of Sn-Ag alloys electrodeposited from pyrophosphate-iodide solutions

被引：27
作者：
Arai, S [1 ]
Watanabe, T
机构：
[1] Precis Technol Res Inst Nagano Prefecture, Nagano 3940000, Japan
[2] Tokyo Metropolitan Univ, Fac Technol, Dept Ind Chem, Hachioji, Tokyo 1920397, Japan
来源：
MATERIALS TRANSACTIONS JIM | 1998年 / 39卷 / 04期
关键词：
tin-silver alloy; electrodeposition method morphology; phase; microstructure; phase diagram;
D O I：
10.2320/matertrans1989.39.439
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Tin-silver (Sn-Ag) alloys, which are considered to be suitable for use as Pb-free solder, were made by an electrodeposition method. A newly developed Sn-Ag alloy electroplating bath containing pyrophosphate and iodide as the complexing agents of Sn and Ag was used. The composition, morphology, phases and microstructure of electrodeposited Sn-Ag allays were studied. The results are summarized as follows: (1) A good relationship was observed between the morphologies of the electrodeposited Sn-Ag alloys and their compositions. (2) The electrodeposited Sn-Ag alloys ranging in Ag content from 5 to 75 at% exhibited two phases (beta-Sn and an intermetallic compound), and were composed of grains of submicron-order diameter. (3) The phase diagram of the electrodeposited Sn-Ag alloys resemble the equilibrium phase diagram of the Sn-Ag alloys.
引用
收藏
页码：439 / 445
页数：7
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