Microstructure of Sn-Ag alloys electrodeposited from pyrophosphate-iodide solutions

被引：27

作者：

Arai, S ^{[1
]}

Watanabe, T

机构：

[1] Precis Technol Res Inst Nagano Prefecture, Nagano 3940000, Japan

[2] Tokyo Metropolitan Univ, Fac Technol, Dept Ind Chem, Hachioji, Tokyo 1920397, Japan

来源：

MATERIALS TRANSACTIONS JIM | 1998年 / 39卷 / 04期

关键词：

tin-silver alloy; electrodeposition method morphology; phase; microstructure; phase diagram;

D O I：

10.2320/matertrans1989.39.439

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Tin-silver (Sn-Ag) alloys, which are considered to be suitable for use as Pb-free solder, were made by an electrodeposition method. A newly developed Sn-Ag alloy electroplating bath containing pyrophosphate and iodide as the complexing agents of Sn and Ag was used. The composition, morphology, phases and microstructure of electrodeposited Sn-Ag allays were studied. The results are summarized as follows: (1) A good relationship was observed between the morphologies of the electrodeposited Sn-Ag alloys and their compositions. (2) The electrodeposited Sn-Ag alloys ranging in Ag content from 5 to 75 at% exhibited two phases (beta-Sn and an intermetallic compound), and were composed of grains of submicron-order diameter. (3) The phase diagram of the electrodeposited Sn-Ag alloys resemble the equilibrium phase diagram of the Sn-Ag alloys.

引用

页码：439 / 445

页数：7

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