Simulation and Characterization of Dynamic Contact in a MEMS Passive Vibration Threshold Sensor

被引:0
作者
Yang, Zhuoqing [1 ]
Chen, Wenguo [1 ]
Ding, Guifu [1 ]
Wang, Yan [1 ]
Wang, Hong [1 ]
Zhao, Xiaolin [1 ]
机构
[1] Shanghai Jiao Tong Univ, Natl Key Lab Sci & Technol Micro Nano Fabricat, Shanghai, Peoples R China
来源
2014 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP) | 2014年
关键词
MEMS; micromachining; vibration threshold sensor; dynamic contact; dropping hammer test; METAL-ELECTROPLATING TECHNOLOGY; SWITCHES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A micro-machined passive vibration threshold sensor (i.e. acceleration switch) with a compliant stationary electrode has been designed, simulated and characterized. Bridge-type elastic beams as the compliant stationary electrode are adopted to improve the contact effect of the sensor. The dynamic contact between the two electrodes is simulated and analyzed by finite-element method (FEM). It is presented that a 'skip contact' phenomenon occurred during the switching on, which has been described and successfully explained in this paper. A drop hammer test of the fabricated vibration threshold sensor was done, which is in accordance with the simulated one. The measured two contact times in the skip contact are 16 mu s and 4 mu s under 55g applied acceleration shock, respectively, which are in agreement with simulated results.
引用
收藏
页码:298 / 302
页数:5
相关论文
共 9 条
[1]   MICROMINIATURE GANGED THRESHOLD ACCELEROMETERS COMPATIBLE WITH INTEGRATED-CIRCUIT TECHNOLOGY [J].
FROBENIUS, WD ;
WHITE, MH ;
ZEITMAN, SA ;
OSULLIVA.DD ;
HAMEL, RG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1972, ED19 (01) :37-+
[2]  
Hsu T R, 2002, MEMS MICROSYSTEMS DE, P56
[3]   MEMS spring probe for non-destructive wafer level chip test [J].
Lee, K ;
Kim, B .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (05) :953-957
[4]   Fabrication and packaging of inertia micro-switch using low-temperature photo-resist molded metal-electroplating technology [J].
Ma, W ;
Li, G ;
Zohar, Y ;
Wong, M .
SENSORS AND ACTUATORS A-PHYSICAL, 2004, 111 (01) :63-70
[5]   Design and characterization of inertia-activated electrical micro-switches fabricated and packaged using low-temperature photoresist molded metal-electroplating technology [J].
Ma, W ;
Zohar, Y ;
Wong, M .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (06) :892-899
[6]   A dynamic model, including contact bounce, of an electrostatically actuated microswitch [J].
McCarthy, B ;
Adams, GG ;
McGruer, NE ;
Potter, D .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2002, 11 (03) :276-283
[7]   Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications [J].
Michaelis, S ;
Timme, HJ ;
Wycisk, M ;
Binder, J .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2000, 10 (02) :120-123
[8]   Low-cost post-CMOS integration of electroplated microstructures for inertial sensing [J].
Wycisk, M ;
Tönnesen, T ;
Binder, J ;
Michaelis, S ;
Timme, HJ .
SENSORS AND ACTUATORS A-PHYSICAL, 2000, 83 (1-3) :93-100
[9]   Micromechanical switches fabricated using nickel surface micromachining [J].
Zavracky, PM ;
Majumder, S ;
McGruer, NE .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1997, 6 (01) :3-9