Molecular dynamics simulation on notch sensitivity of nanocrystalline Cu

被引：1

作者：

Wu, Hejun ^{[1
,2
]}

Tong, Shang ^{[1
,2
]}

Zhou, Jianqiu ^{[1
,2
,3
]}

Zhang, Feng ^{[1
,2
]}

Yang, Baotong ^{[1
,2
]}

机构：

[1] Nanjing Tech Univ, Dept Mech & Power Engn, Nanjing 210009, Jiangsu, Peoples R China

[2] Key Lab Design & Mfg Extreme Pressure Equipment, Nanjing, Jiangsu, Peoples R China

[3] Wuhan Inst Technol, Sch Mech & Elect Engn, Wuhan 430070, Hubei, Peoples R China

来源：

MICRO & NANO LETTERS | 2018年 / 13卷 / 12期

基金：

中国国家自然科学基金;

关键词：

stress-strain relations; tensile strength; notch strength; nanostructured materials; copper; molecular dynamics method; shear deformation; molecular dynamics simulation; notch sensitivity; edge notch; notch size; single shear band; notch root; nanocrystalline copper; tensile loadings; deformation; shear strain; stress concentration; Cu; STRESS-CONCENTRATION; DEFORMATION; NANOSCALE; BEHAVIOR; FRACTURE;

D O I：

10.1049/mnl.2018.5365

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A molecular dynamics (MD) simulation was performed on the nanocrystalline (NC) Cu with an edge notch under tensile loadings, with focus on the notch sensitivity. With the increase of notch size, the dominant deformation of material changes from the shear strain, which spreads throughout the entire sample, to a single shear band, which is induced by the stress concentration at the notch root. At the same time, the samples move from notch-insensitivity to notch-sensitivity. These findings offer significant guidelines for the application of NC Cu in engineering.

引用

页码：1724 / 1727

页数：4

共 24 条

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