An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

被引:74
作者
Zhang, Yao-Jiang [1 ]
Fan, Jun [1 ]
机构
[1] Missouri Univ Sci & Technol, Electromagnet Compatibil Lab, Dept Elect & Comp Engn, Rolla, MO 65409 USA
关键词
Intrinsic via circuit model; parallel-plate modes; physics-based via circuit model; segmentation technique; signal and power integrity; CAPACITANCE; HOLE; MICROSTRIP; EXPRESSIONS; SCATTERING; NETWORK; PROBE;
D O I
10.1109/TMTT.2010.2052956
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains. In the via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges. Boundary conditions at both vias and plate edges are enforced and all parasitic components of via circuit are expressed analytically in terms of parallel-plate modes. The work presented in this paper indicates that a previous physics-based via circuit model from intuition is a low-frequency approximation. Analytical and numerical simulations, as well as measurements, have been used to validate the intrinsic via circuit model.
引用
收藏
页码:2251 / 2265
页数:15
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