Chemistry enhanced shear thickening polishing of Ti-6Al-4V

被引:38
作者
Wang, Jiahuan [1 ,2 ]
Lyu, Binghai [1 ,2 ]
Jiang, Liang [3 ]
Shao, Qi [1 ,2 ]
Deng, Changbang [3 ]
Zhou, Yafeng [1 ,2 ]
Wang, Jinhu [1 ,2 ]
Yuan, Julong [1 ,2 ]
机构
[1] Zhejiang Univ Technol, Coll Mech Engn, Hangzhou, Peoples R China
[2] Zhejiang Univ Technol, Minist Educ & Zhejiang Prov, Ultraprecis Machining Ctr, Key Lab Special Purpose Equipment & Adv Proc Tech, Hangzhou, Peoples R China
[3] Southwest Jiaotong Univ, Tribol Res Inst, State Key Lab Tract Power, Chengdu, Peoples R China
来源
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY | 2021年 / 72卷
基金
中国国家自然科学基金;
关键词
Chemistry enhanced shear thickening polishing; Ti-6Al-4V; pH value; Electrochemistry; Polishing mechanism; TITANIUM; SURFACE; ALLOY; IMPLANTS;
D O I
10.1016/j.precisioneng.2021.04.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To obtain the great surface quality of Ti-6Al-4V and achieve high efficiency in the polishing process, the chemistry enhanced shear thickening polishing (C-STP) was proposed, and the polishing performance of different pH slurry was studied. The results show that the material removal rate gradually increases as the pH value decreases from 10 to 1, and the best surface quality is obtained at pH 2. The corrosion current density and potential were measured by potentiodynamic polarization under three typical pH values. It is confirmed that the most massive corrosion rate presents at pH 2, and the passive film is most susceptible to be produced at pH 10. The reaction resistance was measured by electrochemical impedance spectroscopy to clarify the polishing mechanism. Under acidic conditions, the chemical reaction product on the surface can be quickly removed by mechanical action of the abrasive. On the contrary, the passive film formed on the surface under the alkaline condition is difficult to be removed. The corrosion reaction products were determined by X-ray photoelectron, and the chemical reaction under acid-base environment was derived. MRR reached 107.3 nm/min under the selected process parameters, and the surface roughness (Sa) is reduced from 124 nm to 8.6 nm within 15 min.
引用
收藏
页码:59 / 68
页数:10
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