A review on epoxy-based electrically conductive adhesives

被引:131
|
作者
Aradhana, Ruchi [1 ]
Mohanty, Smita [1 ,2 ]
Nayak, Sanjay Kumar [1 ,2 ]
机构
[1] CIPET, TVK Ind Estate, Chennai 600032, Tamil Nadu, India
[2] CIPET, LARPM, Bhubaneswar, Odisha, India
关键词
Electrically conductive adhesives (ECAs); Epoxy resin; Conduction mechanism; Conductive fillers; Inherently conductive polymers; CARBON-NANOTUBE; MECHANICAL-PROPERTIES; CURE KINETICS; FUNCTIONALIZED GRAPHENE; DIELECTRIC-PROPERTIES; SILVER NANOPARTICLES; PHYSICAL-PROPERTIES; COMPOSITES; NANOCOMPOSITES; FILLER;
D O I
10.1016/j.ijadhadh.2020.102596
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging applications including die fitting, solderless interconnections, component renovation, display interconnections, and heat dissipation, etc. ECAs seize attention of scientific researchers as green and sustainable lead-free interconnection material over conventional solders owing to their eco-friendliness, processing capability at low temperature, fewer processing steps, negligible stress on a substrate, flexibility and stretchability, and cost-effectiveness. Various researchers worked in the area of epoxy based conductive adhesives mainly focusing on the categories, conduction mechanisms, applications of conductive adhesives along with various types of conductive fillers, inherent conductive polymers and future prospective of epoxy resin in the field of conductive adhesives is presented.
引用
收藏
页数:18
相关论文
共 50 条
  • [31] Unveiling the power of 2D carbon-based electrically conductive adhesive: a comparative analysis on structure and performance
    Gholamalizadeh, Naghmeh
    Mirfaeghi, Sajjad
    Sharif, Farhad
    Mazinani, Saeedeh
    Bazargan, Ali Mohammad
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 35 (32)
  • [32] Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs)
    Kwon, Yumi
    Yim, Byung-seung
    Kim, Jong-min
    Kim, Jooheon
    MICROELECTRONICS RELIABILITY, 2011, 51 (04) : 812 - 818
  • [33] Molecular Approach To Enhance Thermal Conductivity in Electrically Conductive Adhesives
    Tseng, Li-Ting
    Jhang, Ren-Huai
    Ho, Jing-Qian
    Chen, Chun-Hu
    ACS APPLIED ELECTRONIC MATERIALS, 2019, 1 (09) : 1890 - 1898
  • [34] Preparation of highly conductive silver nanowires for electrically conductive adhesives
    Lu, Jing
    Liu, Di
    Dai, Junfu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (16) : 15786 - 15794
  • [35] Design and synthesis of ionic-conductive epoxy-based networked polymers
    Matsumoto, Kozo
    Endo, Takeshi
    REACTIVE & FUNCTIONAL POLYMERS, 2013, 73 (02) : 278 - 282
  • [36] The Effect of Carbon Nanofibers on the Mechanical Performance of Epoxy-Based Composites: A Review
    Santos, Paulo
    Silva, Abilio P.
    Reis, Paulo N. B.
    POLYMERS, 2024, 16 (15)
  • [37] A review of recent progress in improving the fracture toughness of epoxy-based composites using carbonaceous nanofillers
    Mousavi, Seyed Rasoul
    Estaji, Sara
    Paydayesh, Azin
    Arjmand, Mohammad
    Jafari, Seyed Hassan
    Nouranian, Sasan
    Khonakdar, Hossein Ali
    POLYMER COMPOSITES, 2022, 43 (04) : 1871 - 1886
  • [38] Epoxy resin/graphite electrically conductive nanosheet nanocomposite
    Lu, W
    Weng, JX
    Wu, DJ
    Wu, CL
    Chen, GH
    MATERIALS AND MANUFACTURING PROCESSES, 2006, 21 (02) : 167 - 171
  • [39] A novel connecting material: electrically conductive adhesives based on polyimide resin and conductive ceramic powders
    You, Shengjie
    Wu, Yong
    Sun, Tiancheng
    Huang, Xingmai
    Qi, Liying
    Zhang, Jiajing
    Hao, Sue
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (10) : 10405 - 10410
  • [40] Rheological and antimicrobial properties of epoxy-based hybrid nanocoatings
    Islam, M. R.
    Parimalam, M.
    Sumdani, M. G.
    Taher, M. A.
    Asyadi, F.
    Yenn, T. W.
    POLYMER TESTING, 2020, 81