A review on epoxy-based electrically conductive adhesives

被引：157

作者：

Aradhana, Ruchi ^{[1
]}

Mohanty, Smita ^{[1
,2
]}

Nayak, Sanjay Kumar ^{[1
,2
]}

机构：

[1] CIPET, TVK Ind Estate, Chennai 600032, Tamil Nadu, India

[2] CIPET, LARPM, Bhubaneswar, Odisha, India

来源：

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2020年 / 99卷

关键词：

Electrically conductive adhesives (ECAs); Epoxy resin; Conduction mechanism; Conductive fillers; Inherently conductive polymers; CARBON-NANOTUBE; MECHANICAL-PROPERTIES; CURE KINETICS; FUNCTIONALIZED GRAPHENE; DIELECTRIC-PROPERTIES; SILVER NANOPARTICLES; PHYSICAL-PROPERTIES; COMPOSITES; NANOCOMPOSITES; FILLER;

D O I：

10.1016/j.ijadhadh.2020.102596

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Electrically conductive adhesives (ECAs) are widely utilized in various electronic packaging applications including die fitting, solderless interconnections, component renovation, display interconnections, and heat dissipation, etc. ECAs seize attention of scientific researchers as green and sustainable lead-free interconnection material over conventional solders owing to their eco-friendliness, processing capability at low temperature, fewer processing steps, negligible stress on a substrate, flexibility and stretchability, and cost-effectiveness. Various researchers worked in the area of epoxy based conductive adhesives mainly focusing on the categories, conduction mechanisms, applications of conductive adhesives along with various types of conductive fillers, inherent conductive polymers and future prospective of epoxy resin in the field of conductive adhesives is presented.

引用

页数：18

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