Sn-Ag solder bump formation for flip-chip bonding by electroplating

被引：39
|
作者：
Arai, S [1 ]
Akatsuka, H [1 ]
Kaneko, N [1 ]
机构：
[1] Shinshu Univ, Fac Engn, Dept Chem & Mat Engn, Nagano 3808553, Japan
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2003年 / 150卷 / 10期
关键词：
D O I：
10.1149/1.1606687
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Pb-free Sn-Ag alloy solder bumps for flip-chip bonding were formed by electroplating with the aid of a photolithography. Pyrophosphate-iodide baths were used for the plating bath. Smooth, fine-grained Sn-Ag alloy films were obtained using a bath containing both polyethylene glycol (mean molecular weight 600, PEG600) and formaldehyde (HCHO) additives. Sn-Ag alloy films with near eutectic compositions (Sn-3.8 atom % Ag) were obtained under both galvanostatic and potentiostatic conditions. All of the Sn-Ag alloy films deposited consisted of beta-Sn phase and epsilon(Ag(3)Sn) phase. Straight-walled bumps and mushroom bumps were formed under both galvanostatic and potentiostatic conditions from the pyrophosphate-iodide bath containing both PEG600 and HCHO. Mushroom bumps with smooth surfaces and homogeneous composition were obtained under potentiostatic conditions. (C) 2003 The Electrochemical Society.
引用
收藏
页码：C730 / C734
页数：5
相关论文
共 50 条
  • [1] Fluxless Sn-Ag solder ball formation for flip-chip application
    Flachsbart, B
    Hsieh, KC
    OPTOELECTRONIC PACKAGING, 1996, 2691 : 54 - 60
  • [2] Formation of octahedral corrosion products in Sn-Ag flip chip solder bump
    Kang, Hanbyul
    Lee, Miji
    Sun, Dongyoon
    Pae, Sangwoo
    Park, Jongvvoo
    SCRIPTA MATERIALIA, 2015, 108 : 126 - 129
  • [3] Study on the Sn-Pb and Sn-Ag electroplating for bump formation in flip chip application
    Hwang, H
    Hong, SM
    Kang, CS
    Jung, JP
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1103 - 1106
  • [4] Effect of Current Densities on the Electromigration Failure Mechanisms of Flip-Chip Sn-Ag Solder Bump
    Kim, Gahui
    Son, Kirak
    Park, Gyu-Tae
    Park, Young-Bae
    KOREAN JOURNAL OF METALS AND MATERIALS, 2017, 55 (11): : 798 - 805
  • [5] Eutectic sn-ag solder bump process for ULSI flip chip technology
    Ezawa, H
    Miyata, M
    Honma, S
    Inoue, H
    Tokuoka, T
    Yoshioka, J
    Tsujimura, M
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (04): : 275 - 281
  • [6] Eutectic Sn-Ag solder bump process for ULSI flip chip technology
    Ezawa, H
    Miyata, M
    Honma, S
    Inoue, H
    Tokuoka, T
    Yoskioka, J
    Tsujimura, M
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1095 - 1100
  • [7] FLIP-CHIP BONDING USING SUPERCONDUCTING SOLDER BUMP
    OGASHIWA, T
    NAKAGAWA, H
    AKIMOTO, H
    SHIGYO, H
    TAKADA, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (8A): : 4043 - 4046
  • [8] Flip-chip bonding using superconducting solder bump
    Ogashiwa, Toshinori
    Nakagawa, Hiroshi
    Akimoto, Hideyuki A.
    Shigyo, Hiroyuki
    Takada, Susumu
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1995, 34 (8 A): : 4043 - 4046
  • [9] Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint
    Ha, Sang Su
    Kang, Hanbyul
    Kim, Gun Rae
    Pae, Sangwoo
    Lee, Haebum
    MATERIALS TRANSACTIONS, 2016, 57 (11) : 1966 - 1971
  • [10] Electrodeposition and Characterization of Eutectic Sn-Ag Alloy as Solder Bumps for Flip-Chip Interconnection
    Qin, Yi
    Wilcox, G. D.
    Liu, Changqing
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (10) : D424 - D430
12345