In situ electrostatic microactuators for measuring the Young's modulus of CMOS thin films

被引:18
作者
Dai, CL [1 ]
机构
[1] Natl Chung Hsing Univ, Dept Mech Engn, Taichung 402, Taiwan
关键词
PRESSURE SENSOR; TECHNOLOGY; FABRICATION; SWITCHES;
D O I
10.1088/0960-1317/13/5/306
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents an electrostatic microactuator chip for measuring the Young's modulus of thin films. The major feature of this chip is that it contains two electrostatic microactuators which can measure the relationship between the force and the deformation of thin films and evaluate the Young's modulus of aluminum (Al) and silicon dioxide (SiO2) thin films. The chip was fabricated using the 0.6 mum single polysilicon three metal (SPTM) complementary metal-oxide semiconductor (CMOS) process and post-processing. The post-processing depends on only maskless dry etching. Experimental results indicate that the Young's modulus of Al films is 55 +/- 6 GPa and that of SiO2 films is 61 +/- 7 GPa in the 0.6 mum SPTM CMOS process.
引用
收藏
页码:563 / 567
页数:5
相关论文
共 24 条
[11]   Contactless measurement of the elastic Young's modulus of paper by an ultrasonic technique [J].
Khoury, M ;
Tourtollet, GE ;
Schröder, A .
ULTRASONICS, 1999, 37 (02) :133-139
[12]   An acceleration sensor in CMOS-compatible technology for integration in complex systems [J].
Lang, M ;
Glesner, M .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1997, 7 (03) :193-195
[13]   Study of integrated RF passive components performed using CMOS and Si micromachining technologies [J].
LopezVillegas, JM ;
Samitier, J ;
Bausells, J ;
Merlos, A ;
Cane, C ;
Knochel, R .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1997, 7 (03) :162-164
[14]   Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications [J].
Michaelis, S ;
Timme, HJ ;
Wycisk, M ;
Binder, J .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2000, 10 (02) :120-123
[15]  
Najafi K., 1991, Journal of Micromechanics and Microengineering, V1, P86, DOI 10.1088/0960-1317/1/2/002
[16]   YOUNGS MODULUS MEASUREMENTS OF THIN-FILMS USING MICROMECHANICS [J].
PETERSEN, KE ;
GUARNIERI, CR .
JOURNAL OF APPLIED PHYSICS, 1979, 50 (11) :6761-6766
[17]   2-DIMENSIONAL INTEGRATED GAS-FLOW SENSORS BY CMOS IC TECHNOLOGY [J].
ROBADEY, J ;
PAUL, O ;
BALTES, H .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1995, 5 (03) :243-250
[18]  
SCHODEK DL, 1992, STRUCTURES
[19]   A novel spiral CMOS compatible micromachined thermoelectric IR microsensor [J].
Socher, E ;
Bochobza-Degani, O ;
Nemirovsky, Y .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2001, 11 (05) :574-576
[20]   CMOS foundry-based micromachining [J].
Tilmans, HAC ;
Baert, K ;
Verbist, A ;
Puers, R .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1996, 6 (01) :122-127