Reliability challenges in analog and mixed signal technologies

被引：21

作者：

Chaparala, Prasad ^{[1
]}

Brisbin, Douglas ^{[1
]}

Kim, Jonggook ^{[1
]}

OConnell, Barry ^{[1
]}

机构：

[1] Natl Semicond Corp, 2900 Semicond Dr,M-S E-155, Santa Clara, CA 95052 USA

来源：

IPFA 2007: PROCEEDINGS OF THE 14TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS | 2007年

关键词：

D O I：

10.1145/1287853.1287870

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Unique analog product application requirements such as high speed, low noise, low power, high precision and high voltage demand complex analog process technologies. This complexity poses several reliability challenges that are specific to each technology. In this paper some of the key reliability mechanisms in most common analog process technologies are highlighted. To meet broad range of analog IC reliability requirements, in-depth device reliability characterization is essential besides the traditional process reliability qualification.

引用

页码：135 / +

页数：3

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