High-speed on-chip and chip-to-chip optical interconnection

被引：0

作者：

Tsuda, H ^{[1
]}

Nakahara, T ^{[1
]}

机构：

[1] Keio Univ, Kohoku Ku, Yokohama, Kanagawa, Japan

来源：

FUNDAMENTAL PROBLEMS OF OPTOELECTRONICS AND MICROELECTRONICS | 2003年 / 5129卷

关键词：

D O I：

10.1117/12.501668

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The present and the potential performances of opto-electronic elements such as a laser diode (LD), a photo diodes (PD) and an optical waveguide for optical interconnects are described. The fabrication and the integration technologies of the opto-electronic chips are also mentioned. The topics to be highlighted include: (1) the state of the art of vertical cavity surface emitting laser diodes (VCSELs) for optical interconnects, (2) the performance analysis of the optical interconnects with integrated optical waveguides and free space optics, and (3) Opto-electronic integration technology: hybrid-integration technique [1], receiver and transmitter design for on-chip and intra-chip optical interconnects.

引用

页码：18 / 23

页数：6

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