Recent progress on additive manufacturing of multi-material structures with laser powder bed fusion

被引:232
作者
Wang, Di [1 ]
Liu, Linqing [1 ]
Deng, Guowei [1 ]
Deng, Cheng [1 ]
Bai, Yuchao [2 ]
Yang, Yongqiang [1 ]
Wu, Weihui [3 ]
Chen, Jie [1 ]
Liu, Yang [4 ]
Wang, Yonggang [4 ]
Lin, Xin [5 ]
Han, Changjun [1 ]
机构
[1] South China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510641, Guangdong, Peoples R China
[2] Natl Univ Singapore, Dept Mech Engn, Singapore, Singapore
[3] Shaoguan Univ, Sch Intelligent Engn, Shaoguan, Peoples R China
[4] Ningbo Univ, Lab Impact & Safety Engn, Minist Educ, Ningbo, Peoples R China
[5] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian, Peoples R China
基金
中国国家自然科学基金;
关键词
Additive manufacturing; laser powder bed fusion; multi-material structures; interface; equipment; FUNCTIONALLY GRADED MATERIAL; MECHANICAL-PROPERTIES; INTERFACIAL CHARACTERIZATION; STAINLESS-STEEL; TITANIUM-ALLOYS; SLM PARTS; MICROSTRUCTURE; METAL; TI-6AL-4V; STRENGTH;
D O I
10.1080/17452759.2022.2028343
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Laser powder bed fusion (LPBF) additive manufacturing has been advancing in the fabrication of metallic multi-material structures with intricate structures and refined material layouts. Herein, a comprehensive review of the recent achievements of multi-material structures via LPBF is provided in terms of interface characteristics and strengthening methods, critical technical issues and potential applications. It begins with the introduction of multi-material structures and the scope of the review. The interface characteristics (including representative multi-material types printed by LPBF, interfacial microstructure, defects, etc.) and strengthening methods of multi-material structures are then presented. Thereafter, the critical technical issues in LPBF for multi-material structures are discussed with regard to equipment development, data preparation, thermodynamic calculation and process simulation, and powder cross-contamination and recycling. Moreover, the potential applications (particularly in biomedical, electronic, aerospace) are illustrated and discussed. Finally, the outlook is outlined to provide guidance for future research.
引用
收藏
页码:329 / 365
页数:37
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