Low-power hermetically sealed on-chip plasma light source micromachined in glass

被引：0

作者：

Carazzetti, P. ^{[1
]}

Renaud, Ph. ^{[1
]}

Shea, H. ^{[1
]}

机构：

[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland

来源：

MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (< 500 mW) RF plasma.

引用

页码：818 / 821

页数：4

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