Constructing three-dimensional boron nitride network for highly thermally conductive epoxy resin composites

被引：45

作者：

Wu, Xian ^{[1
]}

Liu, Wei ^{[1
]}

Shi, Fa-guo ^{[2
]}

Yang, Le ^{[1
]}

Zhang, Chun ^{[1
]}

机构：

[1] Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang 550003, Peoples R China

[2] Guizhou Yong Hong Aviat Machinery Co Ltd, Guiyang, Peoples R China

来源：

POLYMER COMPOSITES | 2022年 / 43卷 / 03期

基金：

中国国家自然科学基金;

关键词：

boron nitride; epoxy resin; thermal conductive network; thermal conductivity; NATURAL-RUBBER; FILMS;

D O I：

10.1002/pc.26490

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

Construction of heat conduction channels in polymer matrix plays a key role in thermally conductive composite. In this work, three-dimensional (3D) boron nitride (BN) framework was successfully fabricated by decomposing the sacrificial material. The resultant 3D-BN framework with honeycomb-like structure was further infiltrated with liquid epoxy resin. With the aid of thermally conductive pathways formed by the 3D-BN framework, the maximum thermal conductivity of EP/3D-BN composites reaches 3.53 W/m center dot K with 55.85 vol% BN, which is 17.6 times larger than that of pure EP. The EP/3D-BN composites demonstrate strong capability to dissipate the heat during heating and cooling processes. This work provides a facile method for developing thermal conductive composites applied in thermal management for electronics.

引用

页码：1711 / 1717

页数：7

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