Studies on surface preparation and smoothness of nanostructured Bi2Te3-based alloys by electrochemical and mechanical methods

被引:22
作者
Feng, Hsien-Ping [2 ]
Yu, Bo [1 ]
Chen, Shuo [2 ]
Collins, Kimberlee [2 ]
He, Chao [2 ]
Ren, Z. F. [1 ]
Chen, Gang [2 ]
机构
[1] Boston Coll, Dept Phys, Chestnut Hill, MA 02467 USA
[2] MIT, Dept Mech Engn, Cambridge, MA 02139 USA
关键词
Nanostructures; Bismuth telluride based alloys; Thermoelectrics; Electrolysis; Chemical mechanical polishing;
D O I
10.1016/j.electacta.2010.12.008
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Significant improvements in the dimensionless thermoelectric figure-of-merit (ZT) for nanostructured bismuth telluride, Bi2Te3, and its alloys have been demonstrated. In designing high-performance thermoelectric devices, variations in the thermal and electrical contact resistances due to interfacial effects between the nanostructured alloy and the metallic electrodes remain a significant issue. Smooth scratch-free surfaces should provide a baseline for contact resistance studies. In this paper, the root mean square roughness over a 10 mu m(2) of nanostructured bismuth tellurium based alloys was reduced from 133 nm to 1.9 nm by a procedure consisting of electrolysis, mechanical polishing, and chemical mechanical polishing (CMP). Post-CMP cleaning was also developed to yield a wettable surface for the subsequent conformable metallization. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:3079 / 3084
页数:6
相关论文
共 21 条
  • [1] Bard A. J., 1985, STANDARD POTENTIALS
  • [2] CAHILL DG, 2004, J HEAT TRANSFER, V124, P223
  • [3] Campbell D. R., 1996, P 1 INT VMIC SPEC C, P145
  • [4] Improved apparatus for picosecond pump-and-probe optical measurements
    Capinski, WS
    Maris, HJ
    [J]. REVIEW OF SCIENTIFIC INSTRUMENTS, 1996, 67 (08) : 2720 - 2726
  • [5] Post-Cu CMP cleaning for colloidal silica abrasive removal
    Chen, PL
    Chen, JH
    Tsai, MS
    Dai, BT
    Yeh, CF
    [J]. MICROELECTRONIC ENGINEERING, 2004, 75 (04) : 352 - 360
  • [6] Investigation of Volmer-Weber growth mode kinetics for germanium nanoparticles on hafnia
    Coffee, Shawn S.
    Ekerdt, John G.
    [J]. JOURNAL OF APPLIED PHYSICS, 2007, 102 (11)
  • [7] Micro-thermoelectric cooler: interfacial effects on thermal and electrical transport
    da Silva, LW
    Kaviany, M
    [J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2004, 47 (10-11) : 2417 - 2435
  • [8] Effect of Additives in Organic Acid Solutions for Post-CMP Cleaning on Polymer Low-k Fluorocarbon
    Gu, Xun
    Nemoto, Takenao
    Teramoto, Akinobu
    Ito, Takashi
    Ohmi, Tadahiro
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (06) : H409 - H415
  • [9] Surface chemistry studies of copper chemical mechanical planarization
    Hernandez, J
    Wrschka, P
    Oehrlein, GS
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (07) : G389 - G397
  • [10] Enhanced Thermoelectric Figure-of-Merit in Nanostructured p-type Silicon Germanium Bulk Alloys
    Joshi, Giri
    Lee, Hohyun
    Lan, Yucheng
    Wang, Xiaowei
    Zhu, Gaohua
    Wang, Dezhi
    Gould, Ryan W.
    Cuff, Diana C.
    Tang, Ming Y.
    Dresselhaus, Mildred S.
    Chen, Gang
    Ren, Zhifeng
    [J]. NANO LETTERS, 2008, 8 (12) : 4670 - 4674