Effect of sulfur passivation on the InP surface prior to plasma-enhanced chemical vapor deposition of SiNx

被引：5
|
作者：
Tang, Hengjing [1 ,2 ]
Wu, Xiaoli [1 ,2 ]
Xu, Qinfei [1 ,2 ]
Liu, Hongyang [1 ,2 ]
Zhang, Kefeng [1 ,2 ]
Wang, Yang [1 ]
He, Xiangrong [1 ]
Li, Xue [1 ]
Gong, Hai Mei [1 ]
机构：
[1] Chinese Acad Sci, Shanghai Inst Tech Phys, State Key Lab Transducer Technol, Shanghai 200083, Peoples R China
[2] Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
来源：
SEMICONDUCTOR SCIENCE AND TECHNOLOGY | 2008年 / 23卷 / 03期
关键词：
D O I：
10.1088/0268-1242/23/3/035031
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The fabrication of Au/SiNx/InP metal-insulator-semiconductor (MIS) diodes has been achieved by depositing a layer of SiNx on the (NH4)(2)S-x-treated n-InP. The SiNx layer was deposited at 200 degrees C using plasma-enhanced chemical vapor deposition (PECVD). The effect of passivation on the InP surface before and after annealing was evaluated by current-voltage (I-V) and capacitance-voltage (C-V) measurements, and Auger electron spectroscopy (AES) analysis was used to investigate the depth profiles of several atoms. The results indicate that the SiNx passivation layer exhibits good insulative characteristics. The annealing process causes distinct inter-diffusion in the SiNx/InP interface and contributes to the decrease of the fixed charge density and minimum interface state density, which are 1.96 x 10(12) cm(-2) and 7.41 x 10(11) cm(-2) eV(-1), respectively. A 256 x 1 InP/InGaAs/InP heterojunction photodiode, fabricated with sulfidation and SiNx passivation layer, has good response uniformity.
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页数：5
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