Subsystem integration for low-cost tire pressure monitoring systems

The scope of this paper is to analyse the trade-offs for system integration for TPMS: Tire Pressure Monitoring Systems. System integration is necessary to meet the cost requirements for systems in the automotive industry. Two ways of integration are discussed: SOC: System On Chip and SIP: System In a Package. The key issue for SOC products is process complexity in combination with testability, whereas success of SIP products is mainly based on packaging technology. The analysis will show that the key factors for system integration are cost, packaging and test. The SOC and SIP trade-offs for TPMS are presented based on Melexis' expertise in manufacturing all required components that are made by IC technology and low cost packaging. These elements are a pressure sensor, a motion sensor, a microcontroller and a RF transmitter.