Subsystem integration for low-cost tire pressure monitoring systems

被引：0

作者：

van der Wiel, A ^{[1
]}

机构：

[1] Melexis Tessenderlo, B-3980 Tessenderlo, Belgium

来源：

ADVANCED MICROSYSTEMS FOR AUTOMOTIVE APPLICATIONS 2003 | 2003年

关键词：

TPMS; system integration; system in a package; MCM; pressure sensing; motion sensing;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The scope of this paper is to analyse the trade-offs for system integration for TPMS: Tire Pressure Monitoring Systems. System integration is necessary to meet the cost requirements for systems in the automotive industry. Two ways of integration are discussed: SOC: System On Chip and SIP: System In a Package. The key issue for SOC products is process complexity in combination with testability, whereas success of SIP products is mainly based on packaging technology. The analysis will show that the key factors for system integration are cost, packaging and test. The SOC and SIP trade-offs for TPMS are presented based on Melexis' expertise in manufacturing all required components that are made by IC technology and low cost packaging. These elements are a pressure sensor, a motion sensor, a microcontroller and a RF transmitter.

引用

页码：271 / 279

页数：9

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