Linewidth Control and the Improved Adhesion of Inkjet-Printed Ag on Polyimide Substrate, Textured Using Near-Atmospheric Pressure Plasmas

被引：6

作者：

Mun, Mu Kyeom ^{[1
]}

Park, Jin Woo ^{[1
]}

Yeom, Geun Young ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 16419, Kyunggi Do, South Korea

来源：

PLASMA PROCESSES AND POLYMERS | 2016年 / 13卷 / 07期

关键词：

direct patterning; flexible device; inkjet printing; near-atmospheric pressure plasma; surface modification; THIN-FILM TRANSISTORS; TEMPERATURE; COMPOSITES; POLYMERS; PATTERNS; GRAVURE; SYSTEMS; ARRAYS; WATER;

D O I：

10.1002/ppap.201500222

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

In this paper, the effect of polyimide surface modification - using near-atmospheric pressure plasmas - on the line width and adhesion of inkjet-printed Ag was investigated by texturing and modifying the chemical composition of the polyimide surface. The polyimide surface was textured with He/O-2, to increase the surface area of the polyimide substrate and it increased the water contact angle from 57 to 137 degrees, when the textured polyimide surface was treated with a SF6 plasma after the texturing process. The textured polyimide surface also exhibited the increased adhesion strength of Ag film (by about two times), due to the increase in the contact area, as expected, according to the Wenzel model. The linewidth of the inkjet-printed Ag line decreased by about ten times from 330 mu m (for the flat polyimide surface) to 23 mu m (for the textured polyimide surface) in addition to having smoother line edges.

引用

页码：722 / 729

页数：8

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