Asymmetric Split-Gate 4H-SiC MOSFET with Embedded Schottky Barrier Diode for High-Frequency Applications

被引:3
作者
Cha, Kyuhyun [1 ]
Kim, Kwangsoo [1 ]
机构
[1] Sogang Univ, Dept Elect Engn, Seoul 04107, South Korea
关键词
4H-SiC; asymmetric; split gate; body diode; switching loss; RELIABILITY; OXIDE;
D O I
10.3390/en14217305
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
4H-SiC Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) with embedded Schottky barrier diodes are widely known to improve switching energy loss by reducing reverse recovery characteristics. However, it weakens the static characteristics such as specific on-resistance and breakdown voltage. To solve this problem, in this paper, an Asymmetric 4H-SiC Split Gate MOSFET with embedded Schottky barrier diode (ASG-MOSFET) is proposed and analyzed by conducting a numerical TCAD simulation. Due to the asymmetric structure of ASG-MOSFET, it has a relatively narrow junction field-effect transistor width. Therefore, despite using the split gate structure, it effectively protects the gate oxide by dispersing the high drain voltage. The Schottky barrier diode (SBD) is also embedded next to the gate and above the Junction Field Effect transistor (JFET) region. Accordingly, since the SBD and the MOSFET share a current path, the embedded SBD does not increase in R-ON,R-SP of MOSFET. Therefore, ASG-MOSFET improves both static and switching characteristics at the same time. As a result, compared to the conventional 4H-SiC MOSFET with embedded SBD, Baliga & PRIME;s Figure of Merit is improved by 17%, and the total energy loss is reduced by 30.5%, respectively.
引用
收藏
页数:10
相关论文
共 23 条
[1]  
Agarwal A., P SOUTHEASTCON 2021, P1
[2]   COMPARISON OF PERFORMANCE AND RELIABILITY BETWEEN MOSFETS WITH LPCVD GATE OXIDE AND THERMAL GATE OXIDE [J].
AHN, J ;
TING, W ;
KWONG, DL .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (12) :2709-2710
[3]  
[Anonymous], FUNDAMENTALS POWER S
[4]  
Baba M., P 3 INT S POW SEM DE, P83
[5]  
Chow TP, 2015, WIPDA 2015 3RD IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS, P402, DOI 10.1109/WiPDA.2015.7369328
[6]  
Conrad M, P 2015 IEEE 6 INT S, P1
[7]   SiC power-switching devices - The second electronics revolution? [J].
Cooper, JA ;
Agarwal, A .
PROCEEDINGS OF THE IEEE, 2002, 90 (06) :956-968
[8]  
Godignon P., P INT SEM C CAS SIN
[9]   Split-Gate 1.2-kV 4H-SiC MOSFET: Analysis and Experimental Validation [J].
Han, Kijeong ;
Baliga, B. J. ;
Sung, Woongje .
IEEE ELECTRON DEVICE LETTERS, 2017, 38 (10) :1437-1440
[10]   A trench/planar SiC MOSFET integrated with SBD (TPSBD) for low reverse recovery charge and low switching loss [J].
Han, Zhonglin ;
Bai, Yun ;
Chen, Hong ;
Li, Chengzhan ;
Lu, Jiang ;
Song, Guan ;
Liu, Xinyu .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2020, 35 (10)