Fast and Accurate Machine Learning Inverse Lithography Using Physics Based Feature Maps and Specially Designed DCNN

被引:4
|
作者
Shi, Xuelong [1 ]
Yan, Yan [1 ]
Zhou, Tao [1 ]
Yu, Xueru [1 ]
Li, Chen [1 ]
Chen, Shoumian [1 ]
Zhao, Yuhang [1 ]
机构
[1] Shanghai Integrated Circuits R&D Ctr Co Ltd, Shanghai, Peoples R China
来源
IWAPS 2020: PROCEEDINGS OF 2020 4TH INTERNATIONAL WORKSHOP ON ADVANCED PATTERNING SOLUTIONS (IWAPS) | 2020年
关键词
Optimal feature maps; inverse lithography technology (ILT); deep convolution neural network (DCNN);
D O I
10.1109/iwaps51164.2020.9286814
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To achieve full chip inverse lithography technology (ILT) solution, we proposed a hybrid approach in this study by combining first few physics based feature maps as model input with a specially designed DCNN structure to learn the rigorous ILT algorithm. Our results show that this approach can make machine learning ILT easy, fast and more accurate.
引用
收藏
页码:9 / 11
页数:3
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