A sulphate bath was used to produce typically 5 mu m thick electrodeposited Ni-Cu/Cu multilayer foils with up to several thousand repeats. After removing the Ti substrate, the room-temperature magnetoresistance was studied as a function of the ferromagnetic Ni-Cu layer thickness. Giant magnetoresistance was observed, which peaked at about 2% for a Ni-Cu layer thicknesses around 2 to 3 nm.