Experimental study on thermal performance of loop heat pipe with a composite-material evaporator for cooling of electronics

被引：27
作者：
He, Song [1 ]
Zhou, Ping [1 ]
Liu, Wei [1 ]
Liu, Zhichun [1 ]
机构：
[1] Huazhong Univ Sci & Technol, Sch Energy & Engn Power, Wuhan 430074, Peoples R China
来源：
APPLIED THERMAL ENGINEERING | 2020年 / 168卷
基金：
中国国家自然科学基金;
关键词：
Loop heat pipe; Composite-material evaporator; Reinforced rib structure; Large thermal footprint; OPERATIONAL CHARACTERISTICS; FLAT EVAPORATOR; BIPOROUS WICKS; LHP;
D O I：
10.1016/j.applthermaleng.2019.114897
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A loop heat pipe (LHP) is one of the most efficient two-phase heat transfer devices. During its operation, a portion of the heat load applied to the evaporator is transferred to its compensation chamber (CC) through the evaporator sidewall, which is known as a heat leak, decreasing the performance of the LHP startup to a certain degree. To reduce a heat leak through the evaporator sidewall, an LHP with a composite-material evaporator was proposed. The evaporator is composed of two types of material, namely, red copper (heating surface) and 316L stainless steel (upper part), and has a reinforced rib structure on the heating surface to improve the evaporator strength. Two sintered nickel wicks are incorporated inside the evaporator. The experimental results demonstrate that the LHP with a composite-material evaporator can operate successfully within a heat load range of 10-140 W while heating the surface to below 80 degrees C at a heat sink temperature of 25 degrees C and 35 degrees C. Compared with an LHP with the same evaporator structure (but with a different in material) (17], the temperature difference between the evaporator outlet and the CC left (right) is smaller under the same heat load, indicating that the heat leak through the evaporator sidewall is reduced.
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页数：8
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