共 19 条
[1]
Asami T., 2010, P 20 INT C AC, P448
[3]
Crack-free high-aspect-ratio drilling of glasses by 1 μm yttrium aluminum garnet laser and translucent adhesive tape
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS,
2004, 43 (2A)
:L133-L135
[4]
NOVEL TECHNIQUE OF LASER THROUGH-HOLE DRILLING IN TEFLON
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS,
1994, 33 (10B)
:L1499-L1501
[5]
Generation of debris in water-assisted femtosecond laser drilling of silica glass
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS,
2005, 44 (11)
:8013-8015
[7]
KOIKE K, 1997, US9755 IEICE
[8]
Eggshell cutter using ultrasonic vibration
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
2003, 42 (5B)
:2996-2999
[10]
Hole drilling of glass substrates with a CO2 laser
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS,
2003, 42 (5A)
:2881-2886