Simulation of boron diffusion in strained Si1-xGex epitaxial layers

被引:3
|
作者
Rajendran, K [1 ]
Schoenmaker, W [1 ]
Decoutere, S [1 ]
Caymax, M [1 ]
机构
[1] IMEC VZW, B-3001 Louvain, Belgium
来源
2000 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES | 2000年
关键词
D O I
10.1109/SISPAD.2000.871244
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a simple and accurate model for boron diffusion in SiGe that was successfully implemented in TAURUS (PMEI). The comparison of the Si1-xGex samples to the Si samples after rapid thermal and furnace annealing revealed a retarded B diffusion inside the strained Si1-xGex layers. The influence of the Ge content on the dopant diffusion was also measured and simulated, demonstrating that the diffusion of B was found to decrease with the Ge alloy content. The model fits for various Ge %(both box and graded profiles) and thermal budgets. The simulation results of various Ge % and thermal budgets show good agreement with measurement data and the predicted B diffusivity show a reasonably low value.
引用
收藏
页码:206 / 209
页数:4
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