High Density Micro-lens Array Connector for Optical Multi-chip Module

被引：5

作者：

Masuda, Koji ^{[1
]}

Hsu, Hsiang-Han ^{[1
]}

Tokunari, Masao ^{[1
]}

Nakagawa, Shigeru ^{[1
]}

机构：

[1] IBM Res Tokyo, Opt Interconnect Technol, Kawasaki, Kanagawa, Japan

来源：

2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2016年

关键词：

micro-lens array; optical multi-chip module; optical interconnection; optoelectronics packaging;

D O I：

10.1109/ECTC.2016.307

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

For efficient light coupling from and into an optical multi-chip module (MCM), the micro-lens array connector (MLAC) is developed. MLAC, composed of a waveguide side lens array and a fiber side connector, integrates 24 collimation micro-lense pairs in its small volume, realizing high bandwidth density, low coupling loss, large alignment tolerance and simple assembling process. In this paper, the mechanical design and optical characteristics of MLAC are introduced. The design criteria and challenges in the assembling processes are also described.

引用

页码：2317 / 2322

页数：6