Creation of compact thermal models of electronic components using model reduction

被引：1

作者：

Guo, X ^{[1
]}

Celo, D ^{[1
]}

Gunupudi, P ^{[1
]}

Khazaka, R ^{[1
]}

Walkey, DJ ^{[1
]}

Smy, T ^{[1
]}

Nakhla, M ^{[1
]}

机构：

[1] Carleton Univ, Dept Elect, Ottawa, ON K1S 5B6, Canada

来源：

TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004 | 2004年

关键词：

model reduction; thermal modeling; IC package model;

D O I：

10.1109/STHERM.2004.1291309

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper presents a new approach to create boundary condition independent thermal compact models based on the multidimensional model reduction (MDMR) technique. A methodology is developed for the generation of a multi dimensional compact model (MDCM) from a detailed numerical model. The MDCM is shown to have a number of advantages over resistor network models. The generation of the model is at least an order of magnitude faster then the creation of an optimized network model. The MDCM displays very high accuracy typically better than 0.1%, is very flexible allowing for the prediction of all internal temperatures, and presents no limitations on the external configuration of the compact model. A generic multi-chip module ball grid array (MCMBGA) package is used to demonstrate the technique. The MDCM created shows to have high predictive capability, boundary condition independence and a small model size. Finally, by connecting the MDCM to a printed circuit board model and simulating the system, speed ups of around 100 times are achieved.

引用

页码：104 / 110

页数：7

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