MEMS-Type Self-Packaged Field-Emission Electron Source

被引：9
作者：
Grzebyk, Tomasz [1 ]
Gorecka-Drzazga, Anna [1 ]
Dziuban, Jan A. [1 ]
机构：
[1] Wroclaw Univ Technol, Fac Microsyst Elect & Photon, PL-50372 Wroclaw, Poland
来源：
IEEE TRANSACTIONS ON ELECTRON DEVICES | 2015年 / 62卷 / 07期
关键词：
Field emission; micro-electro-mechanical system (MEMS); packaging; vacuum encapsulation; vacuum nanoelectronics; WAFER-LEVEL; VACUUM; MICROPUMP;
D O I：
10.1109/TED.2015.2434598
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes a Micro-Electro-Mechanical System-type self-packaged field-emission electron source with a carbon nanotube cathode. It is a multilayer silicon-glass structure, fabricated by the use of the multiple anodic bonding process. Emission characteristics obtained for two-and three-electrode configurations have been reported. The influence of the encapsulation conditions on emission degradation in time has been investigated.
引用
收藏
页码：2339 / 2345
页数：7
相关论文
共 31 条
  • [1] Digital electrostatic electron-beam array lithography
    Baylor, LR
    Lowndes, DH
    Simpson, ML
    Thomas, CE
    Guillorn, MA
    Merkulov, VI
    Whealton, JH
    Ellis, ED
    Hensley, DK
    Melechko, AV
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (06): : 2646 - 2650
  • [2] Busta HH, 2001, VACUUM MICROELECTRONICS, P289, DOI 10.1002/0471224332.ch7
  • [3] Fabrication and characterization of a wafer-level MEMS vacuum package with vertical feedthroughs
    Chae, Junseok
    Giachino, Joseph M.
    Najafi, Khalil
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2008, 17 (01) : 193 - 200
  • [4] Chang-Chien P. P., 2006, TECH REV J, P57
  • [5] Electron field emission from carbon nanotubes
    Cheng, Y
    Zhou, O
    [J]. COMPTES RENDUS PHYSIQUE, 2003, 4 (09) : 1021 - 1033
  • [6] Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
    Cheng, YT
    Hsu, WT
    Najafi, K
    Nguyen, CTC
    Lin, LW
    [J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2002, 11 (05) : 556 - 565
  • [7] Getter free vacuum packaging for MEMS
    Gan, Zhiyin
    Huang, Dexiu
    Wang, Xuefang
    Lin, Dong
    Liu, Sheng
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2009, 149 (01) : 159 - 164
  • [8] Wafer-level vacuum packaging for MEMS
    Gooch, R
    Schimert, T
    McCardel, W
    Ritchey, B
    Gilmour, D
    Koziarz, W
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1999, 17 (04): : 2295 - 2299
  • [9] Grzebyk Tomasz, 2015, Przeglad Elektrotechniczny, V91, P219, DOI 10.15199/48.2015.02.49
  • [10] Glow-discharge ion-sorption micropump for vacuum MEMS
    Grzebyk, T.
    Gorecka-Drzazga, A.
    Dziuban, J. A.
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 2014, 208 : 113 - 119
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