Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments

被引：2

作者：

Tabbert, Chuck ^{[1
]}

Kuznia, Charlie ^{[1
]}

机构：

[1] Ultra Commun Inc, 990 Pk Ctr Dr,Suite H, Vista, CA 92081 USA

来源：

INTERNATIONAL CONFERENCE ON SPACE OPTICS-ICSO 2014 | 2014年 / 10563卷

关键词：

VCSEL; chip-to-chip optical interconnect;

D O I：

10.1117/12.2304174

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

We present fiber optic technology for 850 nm, VCSEL-based embedded optical computing solutions. We introduce concepts for compact, rugged fiber optic transceivers that provide multi-channel operation at 12.5 Gbps per channel. The transceiver can be placed in close proximity to high performance ASICs to provide direct optical I/O between components. The transceiver is packaged with material having match coefficients of thermal expansion (CTE), and expanded beam optical interface - these features offer survivability and operation over wide temperature ranges.

引用

页数：6

共 6 条

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[2]

Huff L, 2011, 2011 OPTICAL FIBER COMMUNICATION CONFERENCE AND EXPOSITION (OFC/NFOEC) AND THE NATIONAL FIBER OPTIC ENGINEERS CONFERENCE

[3]

LAI CP, 2011, P OFC

[4]

Schares Laurent, 2010, Proceedings of the 18th IEEE Symposium on High Performance Interconnects (HOTI 2010), P104, DOI 10.1109/HOTI.2010.10

[5]

Wilson T.E., 2011, 36 ANN GOMACTECH C M

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