Thermal stability of electrodeposited nanocrystalline cobalt

被引：88

作者：

Hibbard, G

Aust, KT

Palumbo, G

Erb, U

机构：

[1] Univ Toronto, Dept Met & Mat Sci, Toronto, ON M5S 3E4, Canada

[2] Integran Technol Inc, Toronto, ON M9W 4Z6, Canada

来源：

SCRIPTA MATERIALIA | 2001年 / 44卷 / 03期

基金：

加拿大自然科学与工程研究理事会;

关键词：

electroplating; nanocrystalline; cobalt; grain growth; activation analysis;

D O I：

10.1016/S1359-6462(00)00628-X

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The thermal stability of electrodeposited nanocrystalline Co was examined. Characterization of the as-deposited microstructure shows a starting grain size of 20 nm and strong basal texture. Modulated differential scanning calorimetry (MDSC) shows the thermal signal during grain growth to be qualitatively similar to that of electrodeposited nanocrystalline Ni. However, the peak temperature and the activation energy of grain growth were found to be higher for nanocrystalline Co than that observed for nanocrystalline Ni of similar as-deposited grain size. The specific excess interfacial enthalpy was estimated to be 1.1 J/m2.

引用

页码：513 / 518

页数：6

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