Research on Dynamic Model of Printed Circuit Board Based on Finite Element Method

被引:6
作者
Wei, Hui [1 ]
Xu, Liangjun [1 ]
机构
[1] Beijing Univ Posts & Telecommun, Beijing, Peoples R China
来源
GREEN ENERGY AND SUSTAINABLE DEVELOPMENT I | 2017年 / 1864卷
关键词
printed circuit board; finite element; modal analysis; vibration; orthogonal anisotropic; boundary conditions; lumped mass; MODAL-ANALYSIS;
D O I
10.1063/1.4992899
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
The vibration characteristics of printed circuit boards are related to the reliability of electronic components installed on their surface. Finite element software is a powerful tool to analyze the vibration characteristics of printed circuit boards, and the correct establishment of finite element model is very important. In this paper, the dynamic model of anisotropic printed circuit board is established by analyzing the material properties of printed circuit board. The influence of boundary condition and lumped mass on the vibration characteristics of printed circuit board is analyzed. In order to establish a more realistic printed circuit The finite element model of the plate provides the necessary basis..
引用
收藏
页数:7
相关论文
共 15 条
[1]  
Aini Maimaitiming, 2013, ANSYS WORKBENCH 14 0
[2]   Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components [J].
Chen, Y. S. ;
Wang, C. S. ;
Yang, Y. J. .
MICROELECTRONICS RELIABILITY, 2008, 48 (04) :638-644
[3]   ESTIMATING THE DYNAMIC BEHAVIOR OF PRINTED-CIRCUIT BOARDS [J].
CIFUENTES, AO .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (01) :69-75
[4]  
Gu Xinshi, 1994, PRINT CIRCUIT INFORM, P36
[5]   STUDY OF SMALL-AMPLITUDE VIBRATIONS OF CLAMPED RECTANGULAR PLATES USING POLYNOMIAL APPROXIMATIONS [J].
LAURA, PA ;
SAFFELL, BF .
JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 1967, 41 (4P1) :836-&
[6]   Finite element model verification for packaged printed circuit board by experimental modal analysis [J].
Lee, Ying-Chih ;
Wang, Bor-Tsuen ;
Lai, Yi-Shao ;
Yeh, Chang-Lin ;
Chen, Rong-Sheng .
MICROELECTRONICS RELIABILITY, 2008, 48 (11-12) :1837-1846
[7]  
Leissa A W., 1980, J SOUND VIBRATION, V31, P257
[8]  
Li Chunyang, 2005, FINITE ELEMENT ANAL
[9]  
Little R. W., 1959, THESIS
[10]  
Liu X., 2011, RES DYNAMIC PERFORMA