Advanced environmental friendly materials for HDI applications

被引：0
|
作者：
Hanamura, K [1 ]
Honda, N [1 ]
Suzuki, T [1 ]
Aoki, M [1 ]
机构：
[1] Toshiba Chem Corp, Elect Parts & Mat Engn Div, Kawaguchi, Japan
来源：
4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS | 2000年
关键词：
D O I：
10.1109/ADHES.2000.860624
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardantes are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, and we have developed halogen-free FR-4 and Resin Coated Copper Foil. Meanwhile, a tendency is also seen to regulate lead within solder, causing progress in the development of lead-free solder. In this report, we describe the effects of halogen-free materials on lead-free solder process.
引用
收藏
页码：296 / 303
页数：8
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