Description of nonlinear viscoelastic behavior and creep-rupture time of anisotropic conductive film

被引:23
作者
Gao, Li-Lan [1 ,2 ]
Chen, Xu [1 ]
Gao, Hong [1 ]
Zhang, Shu-Bao [1 ]
机构
[1] Tianjin Univ, Sch Chem Engn & Technol, Tianjin 300072, Peoples R China
[2] Tianjin Univ Technol, Sch Mech Engn, Tianjin 300191, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2010年 / 527卷 / 20期
关键词
Anisotropic conductive film (ACF); Nonlinear viscoelastic; Constitutive model; Aging damage; Creep-rupture time; POLYMER MATRIX COMPOSITES; BONDING PARAMETERS; RELIABILITY; PERFORMANCE; PREDICTION; LIFETIME;
D O I
10.1016/j.msea.2010.05.002
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A nonlinear viscoelastic model is developed to describe the mechanical behaviors of anisotropic conductive film (ACF). ACF's creep properties are predicted by the model with different stress levels at different temperatures and it is found that the prediction results agree with the experimental ones well. The tensile tests were carried out to validate the model in the situation where both stresses and strains change with time and the results show that the model ensures fair prediction of ACF's tensile mechanical behaviors under time-dependent loading without any additional fitting of adjustable parameters. It is also found that ACF's mechanical behaviors are dependent on the testing temperature and loading rate. A nonlinear viscoelastic model considering aging damage is constructed based on time-aging damage superposition principle and is validated. The creep-rupture time of ACF is predicted based on the modified R-W criterion, and the predicted values agree with experimental data well. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:5115 / 5121
页数:7
相关论文
共 27 条
[1]  
[Anonymous], CREEP RELAXATION NON
[2]  
[Anonymous], T SOC RHEOL
[3]   Durability analysis of polymer matrix composites for structural applications [J].
Cardon, AH ;
Qin, Y ;
Van Vossole, C .
COMPUTERS & STRUCTURES, 2000, 76 (1-3) :35-41
[4]   Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature [J].
Chan, YC ;
Luk, DY .
MICROELECTRONICS RELIABILITY, 2002, 42 (08) :1185-1194
[5]   Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection [J].
Chen, X ;
Zhang, J ;
Jiao, CL ;
Liu, YM .
MICROELECTRONICS RELIABILITY, 2006, 46 (5-6) :774-785
[6]  
Clot P., 1999, Proc. Electronics Manufac. Technol. Symp., P36
[7]  
DILLARD DA, 1982, EXP MECH, V22, pN36
[8]   Modeling of long-term creep behavior of structural epoxy adhesives [J].
Feng, CW ;
Keong, CW ;
Hsueh, YP ;
Wang, YY ;
Sue, HJ .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2005, 25 (05) :427-436
[9]   Mechanical properties of anisotropic conductive film with strain rate and temperature [J].
Gao, Li-Lan ;
Chen, Xu ;
Zhang, Shu-Bao ;
Gao, Hong .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 513-14 :216-221