Advanced Packaging Technologies for Fully Exploiting Attributes of WBG Power Electronics

被引：0
|
作者：
Liang, Zhenxian [1 ]
机构：
[1] Oak Ridge Natl Lab, Power Elect & Elect Machinery Grp, Oak Ridge, TN 37831 USA
来源：
2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP) | 2015年
关键词：
SiC power module; planar bond interconnection; direct cooling; integrated packaging;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A set of technical parameters of power electronics package has been employed to characterize the packaging technologies, in order to improve the criteria such as efficiency, cost-effectiveness and reliability of wide bandgap (WBG) power semiconductors in power conversion applications. Some technologies such as integrated gate driver, planar electrical interconnection, and integrated cooling have been developed. The comprehensive improvements in module's electrical, thermal performance and manufacturability help utilize fully the attributes provided exclusively by the WBG power semiconductors. The technical advancements lead to cost-effective, high efficiency, high power density in automotive electric power conversion systems.
引用
收藏
页码：28 / 31
页数：4
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