Cold atmospheric plasma: Sources, processes, and applications

被引:342
作者
Bardos, L. [1 ]
Barankova, H. [1 ]
机构
[1] Uppsala Univ, Angstrom Lab, Plasma Grp, SE-75121 Uppsala, Sweden
关键词
Cold atmospheric plasma; Non-equilibrium plasma; Atmospheric plasma sources; Atmospheric plasma processing; Surface activation; Surface treatment and deposition; DIELECTRIC BARRIER DISCHARGE; CHEMICAL-VAPOR-DEPOSITION; PRESSURE PLASMA; HOLLOW-CATHODE; THIN-FILMS; CORONA DISCHARGE; CARBON NANOTUBES; POLYMER SURFACES; RF MICROPLASMA; GLOW-DISCHARGE;
D O I
10.1016/j.tsf.2010.07.044
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Atmospheric pressure gas discharge plasmas, especially those operated at energy non-equilibrium and low gas temperatures, have recently become a subject of great interest for a wide variety of technologies including surface treatment and thin-film deposition. A driving force for these developments is the avoidance of expensive equipment required for competing vacuum-based plasma technologies. Although there are many applications where non-equilibrium (cold) plasma at atmospheric and higher pressures represents a substantial advantage, there are also a number of applications where low-pressure plasmas simply cannot be replaced due to specific properties and limitations of the atmospheric plasma and related equipment. In this critical review, the primary principles and characteristics of the cold atmospheric plasma and differences from vacuum-based plasma processes are described and discussed to provide a better understanding of the capabilities and limits of emerging atmospheric plasma technologies. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:6705 / 6713
页数:9
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