Directional solidification of undercooled hypoeutectic silver-copper alloy melt

被引:1
|
作者
Lu, YY [1 ]
Zheng, HX
Xie, FQ
Li, JG
机构
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200030, Peoples R China
[2] Northwestern Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
来源
PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 | 2005年 / 475-479卷
关键词
Ag-Cu alloy; undercooling; directional solidification; solidified characteristic;
D O I
10.4028/www.scientific.net/MSF.475-479.2607
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Directional solidification of the undercooled melt which combines melt undercooling with conventional directional solidification is a new method of obtaining directional structure. This method is used to realize the directional solidification of the undercooled Ag70.3Cu29.7 melt. The experiment is performed in two steps: The undercooled melt is obtained by glass fluxing, and the above specimen is remelted and excited with Ga-In-Sn coolant. By this method, directional solidification dendrites of Ag70.3Cu29.7 alloy are achieved successfully. The columnar dendrites are straight and fine. The primary arm spacing is 21 mu m in average for a 65K undercooling, as compared to 38 mu m for a 32K undercooling. This confirms that higher undercooling promotes finer dendritic microstructures.
引用
收藏
页码:2607 / 2610
页数:4
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